Georgiy Sapunov,Si Cong Tian,S. A. Blokhin,Y.N. Kovach,Denis Papylev,S. S. Rochas,V. V. Andryushkin,E. S. Kolodeznyi,A. V. Babichev,A. G. Gladyshev,I. I. Novikov,A. A. Blokhin,M. A. Bobrov,N. A. Maleev,K. O. Voropaev,V. M. Ustinov,Mansoor Ahamed,K Yu Shugurov,A. Yu. Egorov,L. Ya. Karachinsky,D. Bimberg
标识
DOI:10.1117/12.3000473
摘要
We study high-power high bit rate single-mode 1550 nm vertical-cavity surface-emitting lasers fabricated using wafer-fusion. The optical cavity was grown on an InP wafer, and the two AlGaAs/GaAs distributed Bragg reflectors were grown on GaAs wafers, all three by molecular-beam epitaxy. The active region is based on thin InGaAs/InAlGaAs quantum wells and a composite InAlGaAs tunnel junction. To confine current and optical radiation, we use a lateral-structured buried tunnel junction with ≈ 6 µm diameter and an etching depth of ≈ 20 nm. These VCSELs demonstrate up to 5 mW single-mode continuous-wave output power and a threshold current of ≈ 2 mA at 25 °C. Even at an ambient temperature of 85 °C, the maximum optical output power is larger than 1 mW. The lasers demonstrate a 34 Gbps non-return-to-zero data transfer rate and 42 Gbps (21 GBaud) using 4-level pulse amplitude modulation at 25 °C back-to-back conditions with ≈ 934 fJ/bit power consumption per bit, which is amongst the lowest values reported for this wavelength range and bit rate.