材料科学
卡宾
纳米技术
有机化学
催化作用
化学
作者
Jin-Hyoung Lee,Gunhoo Woo,Gyuyoung Lee,Jongyeong Jeon,Seunghwan Lee,Ziyang Wang,Hyelim Shin,G.H. Lee,Yeon-Ji Kim,Do‐Hyun Lee,Min-Jae Kim,Eungchul Kim,Hyunho Seok,Jinill Cho,Boseok Kang,You-Shin No,Won-Jun Jang,Taesung Kim
标识
DOI:10.1021/acsami.4c04665
摘要
The commercialization of 3D heterogeneous integration through hybrid bonding has accelerated, and accordingly, Cu-polymer bonding has gained significant attention as a means of overcoming the limitations of conventional Cu-SiO
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