Evaluating performance metrics in non-homogeneous cutting processes using a random-grid based digital image correlation (DIC) method

数字图像相关 机械加工 炸薯条 计算机科学 变形(气象学) 启发式 网格 过程(计算) 曲面(拓扑) 数字图像 碎屑形成 算法 材料科学 机械工程 机械 人工智能 图像处理 几何学 图像(数学) 数学 工程类 复合材料 物理 操作系统 电信 刀具磨损
作者
Deepika Gupta,Anirudh Udupa,Koushik Viswanathan
出处
期刊:Manufacturing letters [Elsevier]
卷期号:30: 44-48 被引量:1
标识
DOI:10.1016/j.mfglet.2021.10.004
摘要

The mechanics of chip formation is widely known to be a robust indicator of cutting performance. While chips have been studied and classified for several decades, a direct quantitative correlation between chip morphology and properties of the resulting machined surface is yet to be established. In this work, we develop and demonstrate a digital image correlation (DIC) technique that specifically addresses this issue. Our technique is a departure from standard DIC methods in that it uses an iterative technique on multiple independent random grids, allowing us to obtain accurate full-field deformation measurements during chip formation. The method works especially well at or near free surfaces (e.g., machined surface) and interfaces (e.g., tool-chip contact) and when deformation is temporally unsteady and spatially non-homogeneous. Given that these are central features of nearly all cutting processes, we show how our technique can quantify unsteady, non-uniform flow fields, residual surface and near-surface strains, as well as the amount of redundant deformation during chip formation. These results suggest the use of a simple heuristic test to evaluate critical process performance metrics, such as part surface quality, sub-surface damage and relative energy consumption during machining.

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