铜
箔法
材料科学
冶金
过程(计算)
曲面(拓扑)
电镀(地质)
复合材料
计算机科学
数学
物理
几何学
地球物理学
操作系统
作者
Wen Jing Wang,Xue Feng Liu
出处
期刊:Key Engineering Materials
日期:2017-01-01
卷期号:727: 43-51
标识
DOI:10.4028/www.scientific.net/kem.727.43
摘要
Surface treated copper foil and its preparation is very important and widely used. The science research and enterprise competition always focus on the surface treated methods in the copper foil field. This paper summarized the typical surface treated processes of copper foil, and emphasized on research progress and problems of copper foil surface treated processes. The brush plating-dealloying treated process of copper foil was proposed based on the problems. The principle and research status of new process was introduced. At last, the future development of surface treated process and application prospect were forecast.
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