微电子
超临界流体
光刻胶
纳米技术
材料科学
化学过程
工艺工程
工程物理
化学
工程类
有机化学
图层(电子)
作者
Gina L. Weibel,Christopher K. Ober
标识
DOI:10.1016/s0167-9317(02)00747-5
摘要
Supercritical CO2 technologies have only recently been proposed for microelectronic applications in response to needs for material-compatible cleaning systems, small-dimension developing solvents, and low chemical-use processes. Numerous proposed CO2 applications that are both process enabling and provide potential for chemical abatement in microelectronics engineering are discussed to present readers with the current scope of research in the field. Examples include stripping of photoresist and residues, drying, developing, and spinning of resist, chemical fluid deposition of metals, silylation, and formation and patterning of low-dielectric materials.
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