材料科学
倒装芯片
互连
胶粘剂
导电体
电子包装
集成电路封装
小型化
印刷电路板
芯片级封装
薄脆饼
光电子学
复合材料
纳米技术
集成电路
电气工程
计算机科学
图层(电子)
计算机网络
工程类
作者
Myung Jin Yim,Kyung Wook Paik
标识
DOI:10.1016/j.ijadhadh.2005.04.004
摘要
Anisotropic conductive films (ACFs) consist of conducting particles and adhesive polymer resins in a film type and have been widely used for the flat panel display module to be high-resolution, light weight, thin profile and low power consumption in forms of out lead bonding (OLB), flex to printed circuit board bonding (PCB), chip-on-glass (COG) and chip-on-film (COF) in last decades. As the interconnection pitch between driver IC and flex is decreasing, ACF materials have been evolved to meet the fine pitch capability, low-temperature curing and strong adhesion requirements. Multi-layered ACF structures such as double and triple-layered ACFs were developed for the same reason. Flip chip technology has been well-known as one of the solutions to meet today's semiconductor packaging needs of miniaturization of package size as well as reduction in interconnection distance, resulting in high electrical performance. Especially, flip chip assembly using anisotropic conductive adhesives (ACAs) has been gaining much attention for its simple and lead-free processing as well as cost-effective packaging method. High mechanical reliability, good electrical performance at high-frequency range and effective thermal conductivity for high current density are the required properties for the ACF material for wide use in the flip chip application. In this paper, an overview on the principles, recent development and applications of ACF materials for flat panel displays and semiconductor packaging applications, with focus on the fine pitch capability, low-temperature bonding process, electrical/mechanical/thermal performance and wafer level package using ACFs are described.
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