Surfaces for high heat dissipation with no Leidenfrost limit

Heat dissipation from hot surfaces through cooling droplets is limited by the Leidenfrost point (LFP), in which an insulating vapor film prevents direct contact between the cooling droplet and the hot surface. A range of approaches have been developed to raise this limit to higher temperatures, but the limit still exists. Recently, a surface architecture, decoupled hierarchical structure, was developed that allows the suppression of LFP completely. However, heat dissipation by the structure in the low superheat region was inferior to other surfaces and the structure required an extensive micro/nano fabrication procedure. Here, we present a metallic surface structure with no LFP and high heat dissipation capacity in all temperature ranges. The surface features the nucleate boiling phenomenon independent of the temperature with an approximate heat transfer coefficient of 20 kW m−2 K−1. This surface is developed in a one-step process with no micro/nano fabrication. We envision that this metallic surface provides a unique platform for high heat dissipation in power generation, photonics/electronics, and aviation systems.