碳化硅
电场
半导体
材料科学
宽禁带半导体
工程物理
光电子学
电气工程
纳米技术
工程类
物理
量子力学
冶金
作者
Peter J. Wellmann,Michael Schöler,Philipp Schuh,Michael R. Jennings,Fan Li,Roberta Nipoti,Andrea Severino,Ruggero Anzalone,Fabrizio Roccaforte,Massimo Zimbone,Francesco La Via
标识
DOI:10.1002/9783527824724.ch5
摘要
Since the early days of research in the field of the wide band gap semiconductor silicon carbide (SiC), the cubic polytype has been favorable because it exhibits the highest electron mobility. The electronic band gap and electric breakdown are slightly smaller than the hexagonal 4H-SiC. Therefore, the ideal operation range of power electronic devices based on 3C-SiC lies in the mid-voltage range of 400–600 V as it is used in the large application field of electric automotive applications. The current review presents a state-of-the-art overview over the complete processing change from materials growth to device processing.
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