材料科学
微观结构
合金
马氏体
形状记忆合金
无扩散变换
位错
透射电子显微镜
温度循环
结晶学
冶金
复合材料
热的
热力学
纳米技术
物理
化学
作者
Akira Heima,Yuri Shinohara,Hiroshi Akamine,Minoru Nishida,Tomonari Inamura
标识
DOI:10.1016/j.actamat.2024.119823
摘要
Dislocation accumulation behavior at the lattice correspondence variant (CV) triplets of the Ti-Ni-Cu alloy close to the triplet condition (TC) was investigated by using in situ heating transmission electron microscopy observation. The martensitic microstructure of this alloy was peculiar because of no {011}o compound twin laminate as predicted by the phenomenological theory of martensite crystallography. The peculiar martensitic microstructure was composed of a combination of six different CVs connected by twin-relationship, including triplet and quadruple. Other types of triplets with higher incompatibility were not observed. It was revealed that few transformation-induced dislocations associated with thermal cycling were formed at the compatible martensitic microstructure satisfying the TC in the present alloy. The fact that few transformation-induced dislocations are formed in the TC microstructure in the Ti-30Ni-20Cu alloy during thermal cycling explains the good thermal cycling properties of this alloy.
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