MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives

The addition of V2CTx two-dimensional materials as auxiliary fillers in conductive adhesives can increase the contact area between conductive particles inside the matrix effectively reducing the resistivity of epoxy resin conductive adhesives. The V2CTx/Ag/rGO/MWCNTs fillers inside the epoxy resin will connect more Ag-clad Cu particles to form a conductive pathway, but its excessive content will be aggregated inside and thus increase the resistivity of the conductive adhesive. The volume resistivity of ECAs increases from 4.4 × 10−6 Ω m to 1.15 × 10−5 Ω m when the V2CTx/Ag/rGO/MWCNTs content of 0.1% increases to 0.34%. The Ag-clad Cu particles are interconnected inside the epoxy resin to form an electron transfer network. Inside the epoxy resin substrate Ag-clad Cu particles and V2CTx/Ag/rGO/MWCNTs interconnects to form a larger conductive network, so that the conductive adhesive shows good conductive properties.