Growth of elongated vapor bubbles during flow boiling heat transfer in wavy microchannels

Flow boiling within microchannels is an efficient heat removal mechanism by utilizing the latent heat of the fluid. Numerical simulations can resolve the small temporal and spatial scales of the vapor bubbles in the flow boiling process, thus accessing many details of the flow which is unattainable experimentally. Most of the previous studies of flow boiling heat transfer used straight microchannels, even though curved microchannels have potential to further enhance the heat transfer performance. In this study, the flow boiling heat transfer in wavy microchannels is studied via numerical simulation by focusing on the growth of the vapor bubbles. Straight and wavy microchannels are considered for comparison and analysis. The numerical simulations are conducted using the finite volume method to solve the flow and the heat transfer, and the volume of fluid (VOF) method to capture the interface dynamics. The effects of key dimensionless numbers on bubble growth rate and wall heat transfer are quantified, including the Weber number, the Capillary number, and the Jakob number. The results indicate that the wavy structure of the microchannel has a strong effect on the bubble growth and the wall heat transfer in microchannels. As the waviness of the microchannel increases, the bubble grows faster because of the bubble deformation by the wavy channel, the bubble moves faster due to the bubble expansion, and the heat transfer is enhanced by the perturbation of the bubble to the flow. With the large velocity perpendicular to the channel flow direction induced by the waviness, the local Nusselt number of the wavy channel could be high up to 2.6 times higher than the straight channel.