石墨烯
复合材料
材料科学
极限抗拉强度
复合数
导电体
基质(化学分析)
电阻率和电导率
纳米技术
工程类
电气工程
作者
Junrui Huang,Yubo Zhang,Xi Yang,Jiajing Liu,Xiaona Li,Tingju Li
标识
DOI:10.1016/j.compositesa.2024.108246
摘要
In-depth investigation of the distribution form of the reinforcement and associated mechanisms has great significance for fabricating highly strengthened and conductive Cu matrix composites. The three-dimensional graphene (3DG) network can withstand more strain due to its large specific surface area, and provides interlinked high-speed conductive paths within the composites. In this study, we propose a feasible method to fabricate 3DG-reinforced Cu matrix composites; here, the Cu foam serves as the initial substrate during the chemical vapour deposition (CVD) process and as the matrix of the composites. Through constructing an ideal 3DG network, the graphene content is approximately 0.28 vol%, and a remarkable 230 % improvement in the ultimate tensile strength (418 MPa) with a high electrical conductivity (97.02 %IACS) is obtained in the composite. The continuous high-quality 3DG network is conducive for achieving excellent physico-mechanical properties of the composites, and the enhanced efficiency is superior. A new concept of fabricating Cu matrix composites was proposed for future research.
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