Emerging devices and packaging strategies for electronic-photonic AI accelerators: opinion

光子学 计算机科学 专用集成电路 数码产品 背景(考古学) 光子集成电路 信号处理 嵌入式系统 计算机硬件 电气工程 工程类 材料科学 数字信号处理 古生物学 光电子学 生物
作者
Nicola Peserico,Thomas Ferreira de Lima,Paul R. Prucnal,Volker J. Sorger
出处
期刊:Optical Materials Express [The Optical Society]
卷期号:12 (4): 1347-1347 被引量:37
标识
DOI:10.1364/ome.451802
摘要

The field of mimicking the structure of the brain on a chip is experiencing interest driven by the demand for machine intelligent applications. However, the power consumption and available performance of machine-learning (ML) accelerating hardware still leave much desire for improvement. In this letter, we share viewpoints, challenges, and prospects of electronic-photonic neural network (NN) accelerators. Combining electronics with photonics offers synergistic co-design strategies for high-performance AI Application-specific integrated circuits (ASICs) and systems. Taking advantages of photonic signal processing capabilities and combining them with electronic logic control and data storage is an emerging prospect. However, the optical component library leaves much to be desired and is challenged by the enormous size of photonic devices. Within this context, we will review the emerging electro-optic materials, functional devices, and systems packaging strategies that, when realized, provide significant performance gains and fuel the ongoing AI revolution, leading to a stand-alone photonics-inside AI ASIC ‘black-box’ for streamlined plug-and-play board integration in future AI processors.

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