材料科学
微观结构
液相线
钎焊
复合材料
填充金属
扫描电子显微镜
衍射仪
填料(材料)
润湿
索里达
冶金
焊接
电弧焊
合金
作者
Jie Wu,Songbai Xue,Lu Liu,Peng Zhang,Qingcheng Luo
出处
期刊:Metals
[Multidisciplinary Digital Publishing Institute]
日期:2022-07-06
卷期号:12 (7): 1151-1151
被引量:3
摘要
The influence of Ga content on the melting temperature, wettability, microstructure, and mechanical properties of low-silver 12AgCuZnSn-2In-0.15Pr cadmium-free filler metal was investigated systematically by means of differential thermal analysis, X-ray diffractometer, scanning electron microscopy, energy-dispersive spectrometer, etc. The results showed that the addition of the Ga element reduced the solidus and liquidus temperatures of the novel low-silver filler metals, and effectively increased the spreading area of the filler metal on the copper and 304 stainless steel substrates. Furthermore, an appropriate amount of Ga element significantly optimized the interface morphology and improved the mechanical properties of the brazed joints. When the Ga content was 1wt.%, the shear strength of the brazed joints reached a peak value of 448 MPa, and the corresponding fracture morphology showed typical ductile characteristics with obvious dimples.
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