薄脆饼
光电子学
图像传感器
量子效率
光学
材料科学
雷
前线(军事)
物理
气象学
作者
Hisashi Watanabe,Jun Hirai,Motonari Katsuno,Keishi Tachikawa,Sho Tsuji,Masao Kataoka,Saori Kawagishi,Hiroko Kubo,Hisashi Yano,Shigeru Suzuki,Gen Okazaki,Kouichi Yamamoto,Hiroshi Fujinaka,Takashi Fujioka,Masakatsu Suzuki
出处
期刊:International Electron Devices Meeting
日期:2011-12-01
卷期号:: 8.3.1-8.3.4
被引量:16
标识
DOI:10.1109/iedm.2011.6131513
摘要
A frontside illuminated image (FSI) sensor with novel light guiding structures consisting of stacked lightpipes was developed using 45nm Cu processing on 300 mm wafers. We demonstrated a high quantum efficiency (QE) of 75% and maximum incident angle of 40°, which exceeds the performance of backside illuminated image (BSI) sensors [1,2,3].
科研通智能强力驱动
Strongly Powered by AbleSci AI