均苯四甲酸二酐
聚酰亚胺
材料科学
单体
热塑性塑料
电介质
丙烷
热重分析
高分子化学
马来酸酐
复合材料
共聚物
有机化学
聚合物
化学
图层(电子)
光电子学
作者
Guorong Qiu,Wenshi Ma,Wu Li
标识
DOI:10.1080/25740881.2020.1750651
摘要
The thermoplastic and low dielectric constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4ʹ-(4,4ʹ-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4ʹ-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric analysis, dynamic thermomechanical analysis, dielectric measurement, and tensile test. The dielectric constants were 2.32–2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral methyl groups, made polyimides become thermoplastic. The results of molecular simulations via Materials Studio also proved this conclusion.
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