电感器
可制造性设计
磁芯
电压调节器
微处理器
电压
电容器
电气工程
调节器
计算机科学
可靠性(半导体)
涟漪
工程类
电子工程
电磁线圈
物理
化学
生物化学
量子力学
基因
功率(物理)
作者
Malavarayan Sankarasubramanian,Kaladhar Radhakrishnan,Yongki Min,William J. Lambert,Michael J. Hill,Ashay Dani,Ryan Mesch,Leigh Wojewoda,José Chavarría,Anne Augustine
标识
DOI:10.1109/ectc32862.2020.00071
摘要
Circuit area scaling driven by Moore's law coupled with the push to thinner packages for mobile microprocessors has reduced the volume available for Air Core Inductors (ACI). This translates to a reduction in the conversion efficiency of Fully Integrated Voltage Regulator (FIVR). Magnetic Inductor Array (MIA) modules are used for the first time on the 10 th generation Intel Core™ microprocessor in mobile segments to improve FIVR efficiency. In addition to improving the peak efficiency, it is also possible to realize large light load efficiency gains and minimize voltage ripple through the use of magnetic inductors. This paper covers the magnetic inductor array (MIA) design considerations for improving performance as well as meeting high volume manufacturability and reliability requirements.
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