One-step electrodeposition of superhydrophobic copper coating from ionic liquid

A one-step electrodeposition approach to make a micro-nano superhydrophobic structure on the surface of copper was developed by using Choline chloride (ChCl)-based ionic liquid as the electrolyte. As compared with bare Cu, the contact angle of electrodeposited superhydrophobic coating reaches 157.8°. The corrosion behavior of superhydrophobic copper coating in 3.5 wt% NaCl solution was studied, and the results demonstrate that it exhibited an extraordinary corrosion resistance and had a good protective effect to the Cu substrate.