薄脆饼
晶片键合
材料科学
阳极连接
半导体
热压连接
纳米技术
光电子学
工程物理
复合材料
工程类
图层(电子)
作者
Qiaoling Tong,U. Gösele
摘要
Basics of Interactions Between Flat Surfaces. Influence of Particles, Surface Steps, and Cavities. Surface Preparation and Room-Temperature Wafer Bonding. Thermal Treatment of Bonded Wafer Pairs. Thinning Procedures. Electrical Properties of Bonding Interfaces. Stresses in Bonded Wafers. Bonding of Dissimilar Materials. Bonding of Structured Wafers. Mainstream Applications. Emerging and Future Applications. Index.
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