平版印刷术
小型化
下一代光刻
电子束光刻
计算光刻
X射线光刻
模版印刷
无光罩微影
材料科学
光刻
极紫外光刻
纳米技术
抵抗
光学
光电子学
物理
图层(电子)
标识
DOI:10.1016/j.mee.2014.11.015
摘要
The development of integrated circuits has been stimulated by the miniaturization of the device feature size on a chip. The development of lithographic technologies such as optical lithography and electron beam lithography made important contributions to this miniaturization. Resolution improvement is the most critical issue in the development of optical lithography. On the other hand, in the development of the electron beam lithography, the resolution excellent, but improvement in the throughput capability is the most critical issue. This paper describes the history of resolution improvement efforts in optical lithography and throughput improvement efforts in electron beam lithography through the development history of dynamic random access memories (DRAMs).
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