Harmless process of organic matter in organosilicon waste residue by fluidization-like DDBD reactor: Temperature action and mechanism

Herein, the non-hazardous application of low-temperature plasma technology in solid waste from the silicone industry was investigated by using a fluidization-like double dielectric barrier discharge plasma (DDBD) reactor. The results show ∼92.9% TOC in the organosilicon waste residue could be removed at the conditions (Discharge power: 7.0 W, S/G: 12.5 gminL−1, SIE: 158.0 JL-1), i.e. TOC content decreases from 166.0 g/kg to 11.8 g/kg. At the same time, the energy efficiency of the TOC removal rate reach ∼732.1 gkWh−1, and the temperature of the discharge zone is below 280 °C. According to the TG-MS analysis and infrared thermal imager, it is considered that the heat energy generated in the plasma treatment process can affect the decomposition of organic matter. On the other hand, the samples were characterized before and after treatment by BET, SEM, XRD, FTIR, and GC-MS. It was proposed the organic matter was firstly gasified under the action of plasma and thermal. Then, the active group will generate and react with the C–H, C–C, or C–Si by the bombardment of sufficient energy of charged particles, leading the organic matter further to decompose into small molecules, such as CH4, H2, CO, and CO2.