作者
Youngmin Jo,Anil Kavala,Tongsung Kim,Byung-Kwan Chun,Jung-June Park,Taesung Lee,Jungmin Seo,Manjae Yang,Tae-Hyeon Park,Hyunjin Kwon,C. H. Lee,Younghoon Son,Junghwan Kwak,Younggyu Lee,H. S. Ku,Daehoon Na,Chang-Yeon Yu,Jonghoon Park,JaeHwan Kim,Hyojin Kwon,Chanho Kim,Moon-Ki Jung,Chanjin Park,Dong‐Hyun Seo,Moosung Kim,Seungjae Lee,Jin-Yub Lee,Dongku Kang,Chi-Weon Yoon,Sooyoung Hur
摘要
A 1.2 V, 3.0 Gb/s/pin 16Tb NAND flash memory package with proposed 4 th generation F-chip is presented. It is implemented with self-training techniques such as hybrid delay locked loop (DLL) and 3-step duty cycle correction (DCC) to overcome the speed bottlenecks in F-chip to NAND interface. Also, its multi-termination feature improves power efficiency by providing the use of different terminations on its interfaces. This work achieves an I/O speed of 3.0 Gb/s and power consumption of 58mW which are an improvement of 66% and 23.3%, respectively, in comparison with 3 rd generation F-chip.