离子液体
镍
铜
循环伏安法
共晶体系
无机化学
电解质
材料科学
深共晶溶剂
氯化胆碱
乙二醇
化学
电化学
冶金
微观结构
电极
有机化学
物理化学
催化作用
作者
Hassan H. Abdallah,M.I. Awad,Khozan Haji,Jamil Abdulla Jumaa,Hassan H. Abdallah
标识
DOI:10.1016/j.molliq.2023.121584
摘要
In the current study, the electrodeposition of nickel in the presence of various concentrations of copper ions was studied in a eutectic-based ionic liquid, i.e., 1:2 choline chloride (ChCl):ethylene glycol (EG), which is called Ethaline, at 90 °C. The electrodeposition process was conducted in the presence of additional additives such as nicotinic and boric acids. The electrolyte solution was characterized using a conductivity test and UV–vis analysis. The electrodeposition process is highlighted using cyclic voltammetry (CV) and chronocoulometry (CC). The deposited nickel was subjected to a hardness test and different X-ray techniques, such as SEM, XRD and EDX analysis. The effect of the copper ion concentration on the quality of the electrodeposit was highlighted. It was found that the electrodeposition of nickel from the eutectic-based ionic liquid in the presence of copper ions improved the surface quality, minimized roughness, and promoted consistent surface morphology. The significant difference in the deposit morphology is discussed in the context of metal speciation and mass transport differences between the aqueous and ionic liquids.
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