反应离子刻蚀
蚀刻(微加工)
干法蚀刻
氩
材料科学
感应耦合等离子体
分析化学(期刊)
光刻胶
图层(电子)
托尔
等离子体
燃烧室压力
薄膜
化学
复合材料
纳米技术
冶金
色谱法
物理
有机化学
量子力学
热力学
作者
Changyong Oh,Myeong Woo Ju,Hoyoung Jeong,Junho Song,Bo Sung Kim,D. Lee,Choong-Ho Cho
出处
期刊:Materials
[MDPI AG]
日期:2024-12-20
卷期号:17 (24): 6241-6241
摘要
Inductively coupled plasma–reactive etching (ICP-RIE) of InGaZnO (IGZO) thin films was studied with variations in gas mixtures of hydrochloride (HCl) and argon (Ar). The dry etching characteristics of the IGZO films were investigated according to radiofrequency bias power, gas mixing ratio, and chamber pressure. The IGZO film showed an excellent etch rate of 83.2 nm/min from an optimized etching condition such as a plasma power of 100 W, process pressure of 3 mTorr, and HCl ratio of 75% (HCl:Ar at 30 sccm:10 sccm). In addition, this ICP-RIE etching condition with a high HCl composition ratio at a moderate RIE power of 100 W showed a low etched pattern skew and low photoresist damage on the IGZO patterns. It also provided excellent surface morphology of the SiO2 film underneath after the entire dry etching of the IGZO layer. The IGZO thin film as an active layer was successfully patterned under the ICP-RIE dry etching under the HCl-Ar gas mixture, affording an excellent electrical characteristic in the resultant top-gate IGZO thin-film transistor.
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