Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste

The poly(epoxy-N-methylaniline) conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then, this was mixed with different proportions of silver powder to prepare the lowtemperature conductive silver paste.Afterwards, the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR, DMA and SEM.The results revealed that the prepared conductive paste has good conductivity, film-forming performance, printing performance, low-temperature curing performance, and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60, the lowest volume resistivity of the conductive silver paste was 4.9 × 10 -6 Ω⋅cm, and the conductivity was the best.