A Review of Structure Engineering of Strain‐Tolerant Architectures for Stretchable Electronics

Abstract Stretchable electronics possess significant advantages over their conventional rigid counterparts and boost game‐changing applications such as bioelectronics, flexible displays, wearable health monitors, etc. It is, nevertheless, a formidable task to impart stretchability to brittle electronic materials such as silicon. This review provides a concise but critical discussion of the prevailing structural engineering strategies for achieving strain‐tolerant electronic devices. Not only the more commonly discussed lateral designs of structures such as island‐bridge, wavy structures, fractals, and kirigami, but also the less discussed vertical architectures such as strain isolation and elastoplastic principle are reviewed. Future opportunities are envisaged at the end of the paper.