Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging
材料科学
烧结
纳米压痕
微观结构
复合材料
蠕动
作者
Haixue Chen,Xinyue Wang,Zejun Zeng,Guoqi Zhang,Jing Zhang,Pan Liu