Terry Y.T. Hung,Mengzhan Li,Wei Sheng Yun,Sui An Chou,Shengkai Su,Edward Chen,San Lin Liew,Ying-Mei Yang,Kuang‐I Lin,Vincent Hou,T.Y. Lee,Han Wang,Albert M. K. Cheng,Minn‐Tsong Lin,H.‐S. Philip Wong,Iuliana Radu
标识
DOI:10.1109/iedm45625.2022.10019321
摘要
We present the first demonstration of p-MOSFET with a high ON current of $10^{-5}\mathrm{A}/\mathrm{u}\mathrm{m}$ and good S.S. $\sim 80\mathrm{m}\mathrm{V}/\mathrm{d}\mathrm{e}\mathrm{c}$. MOSFETs have the advantage of lower access resistance compared to Schottky barrier FETs. This requires spacer doping. Here, we introduce a self-limiting, fab-compatible process which consists of $\mathrm{W}\mathrm{O}_{\mathrm{x}}$ obtained from $\mathrm{W}\mathrm{S}\mathrm{e}_{2}$ by O 2 plasma conversion. We analyze the process condition which enhance the doping effect. We quantify the doping level and the impact of the channel bandgap. We demonstrate a self-aligned version of the spacer doping for MOSFET fabrication.