Thermal degradation of polytetrafluoroethylene, modified polytetrafluoroethylene, and their nanocomposites with boron nitride nanobarbs: Lifetime predictions and kinetic analysis

Abstract Flexible polymeric materials including dielectric thermal interface materials (TIMs) used in integrated circuits and other high frequency applications are exposed to extreme thermal and electrical conditions during their service life. Insight into the in‐use thermal stability and material lifetime is valuable to maintaining performance durability and preventing premature failure in actual end use. Herein, the thermal stability of polytetrafluoroethylene (PTFE), modified PTFE and their nanocomposites with recent generation boron nitride nanobarbs (BNNBs) was investigated based on lifetime prediction from thermogravimetric analysis and tensile strength deterioration of heat‐aged samples. Additionally, thermal degradation kinetics and mechanism was investigated using the model‐free advanced isoconversional method based on changing activation energy. The result shows that BNNB extends the lifetime of the PTFE by an order of magnitude. The degradation mechanism proposed from TGA‐MS result is supported by the multistep degradation mechanism identified in the kinetic computation. These results are valuable for predicting materials' in‐use lifetime to avoid premature failure.