热的
可扩展性
材料科学
热冲击
电子设备和系统的热管理
气凝胶
纳米技术
计算机科学
复合材料
热力学
物理
机械工程
数据库
工程类
作者
Feng Xiong,Jiawei Zhou,Yongkang Jin,Zitao Zhang,Mulin Qin,Haiwei Han,Zhenghui Shen,Shenghui Han,Xiaoye Geng,Kaihang Jia,Ruqiang Zou
标识
DOI:10.1038/s41467-024-51530-3
摘要
Improving thermal insulation is vital for addressing thermal protection and energy efficiency challenges. Though silica aerogel has a record-low thermal conductivity at ambient pressure, its high production cost, due to its nanoscale porous structure, has hindered its widespread use. In this study, we introduce a cost-effective and mild method that enhances insulation by incorporating phase change materials (PCMs) into a micron-porous framework. With a thermal conductivity at 0.041 W m
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