自愈水凝胶
材料科学
热稳定性
生物相容性
聚合物
纳米技术
数码产品
化学工程
热导率
复合材料
高分子化学
化学
物理化学
工程类
冶金
出处
期刊:Gels
[MDPI AG]
日期:2022-12-23
卷期号:9 (1): 7-7
被引量:14
摘要
Hydrogels, as a series of three-dimensional, crosslinked, hydrophilic network polymers, exhibit extraordinary properties in softness, mechanical robustness and biocompatibility, which have been extensively utilized in various fields, especially for electronic devices. However, since hydrogels contain plenty of water, the mechanical and electrochemical properties are susceptible to temperature. The thermal characteristics of hydrogels can significantly affect the performance of flexible electronic devices. In this review, recent research on the thermal characteristics of hydrogels and their applications in electronic devices is summarized. The focus of future work is also proposed. The thermal stability, thermoresponsiveness and thermal conductivity of hydrogels are discussed in detail. Anti-freezing and anti-drying properties are the critical points for the thermal stability of hydrogels. Methods such as introducing soluble ions and organic solvents into hydrogels, forming ionogels, modifying polymer chains and incorporating nanomaterials can improve the thermal stability of hydrogels under extreme environments. In addition, the critical solution temperature is crucial for thermoresponsive hydrogels. The thermoresponsive capacity of hydrogels is usually affected by the composition, concentration, crosslinking degree and hydrophilic/hydrophobic characteristics of copolymers. In addition, the thermal conductivity of hydrogels plays a vital role in the electronics applications. Adding nanocomposites into hydrogels is an effective way to enhance the thermal conductivity of hydrogels.
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