Research progress of high thermal conductivity polyimide dielectric films

In the era of highly thin, multi-functional and integrated electronic devices, it will inevitably lead to the heat accumulation inside the composite material, thereby seriously affecting the operation stability and service life of the equipment. How to realize the rapid and efficient heat conduction and heat dissipation of dielectric materials has become a bottleneck problem restricting the further development of electronic devices. The intrinsic thermal conductivity of traditional polyimide is low, which limits its application in electrical equipment, smart grid and other fields. The development of new high thermal conductivity polyimide dielectric film materials has become the focus of research. This paper introduces the thermal conduction mechanism of composite materials, summarizes the research progress and development status of thermally conductive polyimide films in recent years, and focuses on the effects of thermally conductive fillers, interface compatibility, and molding process of the thermal conductivity of materials. Finally, some key scientific and technical issues in the research are summarized and prospected in combination with the future development needs of thermally conductive polyimide composite dielectric materials.