绝缘栅双极晶体管
材料科学
印刷电路板
制作
炸薯条
二极管
dBc公司
功率半导体器件
电阻抗
电源模块
光电子学
电气工程
热的
热阻
功率(物理)
电子工程
工程类
电压
病理
气象学
物理
医学
量子力学
CMOS芯片
替代医学
作者
Ankit Sharma,Dheeman Paul,Marvin Kreck,Yasser Rahmoun,P. Anders,Michael Gruber,Till Huesgen
出处
期刊:2018 7th Electronic System-Integration Technology Conference (ESTC)
日期:2016-09-01
卷期号:: 1-5
被引量:17
标识
DOI:10.1109/estc.2016.7764706
摘要
This paper presents a novel approach to embed power semiconductor devices into a printed circuit board. Here, IGBTs and diodes with reinforced top side chip contact are used in an IGBT half bridge with 25 A / 1200 V rating. Thermal simulations highlight the improved thermal impedance caused by the reinforced top contact and the benefits of the insulated copper substrate compared to a commercial DBC-based reference module. The fabrication process is discussed in detail and preliminary test results are presented. The results of the thermal characterization support the theoretical considerations.
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