铜
催化作用
电极
化学
电催化剂
无机化学
电解质
碳纤维
电化学
材料科学
物理化学
有机化学
复合数
复合材料
作者
Joseph H. Montoya,Andrew A. Peterson,Jens K. Nørskov
出处
期刊:Chemcatchem
[Wiley]
日期:2013-01-31
卷期号:5 (3): 737-742
被引量:358
标识
DOI:10.1002/cctc.201200564
摘要
Abstract We present a first‐principles theoretical study of carbon–carbon coupling in CO 2 electroreduction on the copper 2 1 1 surface. Using DFT, we have determined kinetic barriers to the formation of a CC bond between adsorbates derived from CO. The results of our nudged elastic band calculations demonstrate that kinetic barriers to CC coupling decrease significantly with the degree of hydrogenation of reacting adsorbates. We also show that this trend is not affected by the electrical fields present at the solid‐electrolyte interface during electrocatalysis. Our results explain how copper can catalyze the production of higher hydrocarbons and oxygenates in the electrochemical environment, despite producing only single carbon atom products in gas‐phase catalysis, and how CC bonds can be formed at room temperature in the electrochemical environment, whereas substantially higher temperatures are needed in the Fischer–Tropsch catalysis. The unique feature of the electrochemical environment is that the chemical potential of hydrogen (electrons and protons) can be varied through the applied potential. This allows a variation of the degree of hydrogenation of the reactants and thus the activation barrier for CC coupling.
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