捆绑
互连
串扰
碳纳米管
材料科学
电容感应
光电子学
纳米技术
电子工程
电气工程
工程类
复合材料
电信
作者
Shaoning Pu,Wen‐Yan Yin,Jun‐Fa Mao,Qing Liu
标识
DOI:10.1109/ted.2009.2014429
摘要
The crosstalk effects in single- and double-walled carbon-nanotube (SWCNT and DWCNT) bundle-interconnect architectures are investigated in this paper. Some modified equivalent-circuit models are proposed for both SWCNT and DWCNT bundles, where capacitive couplings between adjacent bundles are incorporated. These circuit models are further used to predict the performance of SWCNT and DWCNT bundle interconnects in comparison with the Cu wire counterpart at all interconnect levels for advanced future technology generations. It is found that, compared with the SWCNT bundle, the DWCNT bundle interconnect can lead to a reduction of crosstalk-induced time delay, which will be more significant with increasing bundle length, while the peak voltage of the crosstalk-induced glitch in SWCNT and DWCNT bundle interconnects is in the same order as that of Cu wires. Due to the improvement in time delay, it is numerically confirmed that the DWCNT bundle interconnect will be more suitable for the next generation of interconnect technology as compared with the SWCNT bundle counterpart.
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