晶界
腐蚀
冶金
材料科学
性格(数学)
微观结构
电化学
分布(数学)
晶界强化
粒度
数学
电极
几何学
化学
数学分析
物理化学
作者
Yanan Zhao,Y.B. Cong,Xiaoyu Zhu,Wenying Liu,Yang Liu,Dongyin Wang
出处
期刊:Russian Journal of Electrochemistry
[Springer Nature]
日期:2020-12-01
卷期号:56 (12): 1031-1036
被引量:3
标识
DOI:10.1134/s1023193520120289
摘要
In this study, we focus on the effect of solid-solution treatment on the susceptibility to intergranular corrosion and electrochemical corrosion of 304 stainless steel. The results show that with the solution temperature rises, the grain size of the steel increases and the intergranular corrosion tendency decreases. After corrosion, it exhibits a step microstructure and grooves at grain boundary on surface of the steel. The corrosion resistance of the steel can be improved by means of properly increasing the solution temperature and choosing a faster cooling way such as water quenching. Besides, with the nitric acid solution temperature rises, the corrosion current (Icorr) increases and the pitting corrosion potential decreases, in which pitting corrosion is more likely to happen. Moreover, in high concentration of nitric acid, a stability passive film can be formed on the surface of 304 stainless steel, which prevents the reaction of the anode, lowers the corrosion, and shows a better anti-corrosive ability.
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