Manufacturable Perovskite/Silicon Tandems with Solution-Processed Perovskites on Textured Silicon Bottom Cells

Integrating perovskites onto textured silicon bottom cells with a scalable solution process is crucial to commercializing perovskite/silicon tandem technology. Here, we propose a new tandem architecture that enables a scalable solution blading process of perovskites on textured silicon. In this tandem architecture, the pyramidal texture is tuned to be less than 1 micron. With this pyramid feature size, the silicon cell surface is rough enough to scatter the light to reduce the reflection loss, but still smooth enough to solution process the perovskite cell. A nitrogen-assisted blading process is then applied to deposit both a conformal hole transport layer and a compact micron-thick perovskite layer to planarize the textured silicon. With additional textured polydimethylsiloxane (PDMS) on the tandem as an antireflection layer, we achieve 26%-efficient perovskite/silicon tandem cells on textured silicon by solution processed perovskite layer, with a short-circuit current density of 19.2 mA/cm ² .