放大器
异质结双极晶体管
序言
偏压
比克莫斯
线性
电气工程
补偿(心理学)
结温
射频功率放大器
材料科学
电子工程
大气温度范围
晶体管
功率(物理)
双极晶体管偏压
双极结晶体管
计算机科学
光电子学
电压
工程类
物理
CMOS芯片
气象学
频道(广播)
精神分析
量子力学
心理学
作者
Hamza Najjari,Christophe Cordier,Stephane David,Serge Bardy,Jean-Baptiste Bégueret
标识
DOI:10.1109/rfic.2018.8429023
摘要
This paper describes DEVM challenges and long packet issues during a linear Power Amplifier (PA) design. Based on Hetero-junction Bipolar Transistor (HBT) electrothermal behavior, a programmable temperature compensating bias is designed to improve the PA linearity. This temperature compensation is applied to a fully integrated 5 GHz BiCMOS HBT PA to improve the DEVM over a junction temperature range from 25°C to 180°C. For a long packet data transmission (4 ms), the power gain variation is reduced to only 156 mdB for an 8μs preamble and 27 mdB for a 90μs preamble. With the proposed temperature adaptative bias, the PA can achieve DEVM lower than -47 dB up to 16.5 dBm output power.
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