MOSFET
信道长度调制
二极管
材料科学
接触电阻
阈值电压
光电子学
电压
电气工程
泄漏(经济)
晶体管
工程类
纳米技术
图层(电子)
经济
宏观经济学
出处
期刊:IEE proceedings
[Institution of Electrical Engineers]
日期:1989-01-01
卷期号:136 (3): 138-138
被引量:1
标识
DOI:10.1049/ip-g-2.1989.0024
摘要
The paper examines in detail a recent technique for measuring contact resistance of a MOSFET. It is observed that the equations used for determining the contact resistance based on the ‘diode’ mode and the ‘MOSFET’ mode differ by a constant factor depending on the device geometry in the limit when the sheet resistance dominates. Ideally, the ratio of the probe voltage/drain current (Vm/I) is independent of the drain current and always higher for the MOSFET mode. In the measurement of a conventional MOSFET we observe a current-dependent Vm/I. This could be explained by the presence of a depletion region near the voltage probe. A word of caution is given with regard to the effects of leakage in the oxide side-wall for a smallgeometry MOSFET.
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