材料科学
过热(电)
电场
数码产品
纳米技术
铁电聚合物
相变
制冷
光电子学
电介质
机械工程
铁电性
电气工程
凝聚态物理
物理
量子力学
工程类
作者
Fang Wang,Zhong-Ye Wang,Yaorong Luo,Ming‐Ding Li,Yurong Yang,Wei Li,Xiaoliang Wang,Tiannan Yang,Qun‐Dong Shen
标识
DOI:10.1038/s41467-024-55726-5
摘要
Overheating remains a major barrier to chip miniaturization, leading to device malfunction. Addressing the urgent need for thermal management promotes the development of solid-state electrocaloric cooling. However, enhancing passive heat dissipation through two-dimensional materials in electrocaloric polymers typically compromises the electrocaloric effect. In this work, we utilize two-dimensional polyamide with porous structure and hydrogen bonding to achieve multiple polar conformations with short-range order in the electrocaloric composite polymers. The structure minimizes intermolecular interactions while reducing energy barriers for field-driven polar-nonpolar conformational transitions. The electrocaloric polymer exhibits doubled cooling efficiency at electric fields as low as 40 MV m−1. Additionally, the electrode design achieves a vertical deformation of 2 millimeters, demonstrating the feasibility of self-driven electric refrigeration devices. This porous organic two-dimensional material resolves cooling efficiency limitations from spatial confinement, advancing the integration of two-dimensional materials in flexible electronics. Solid-state cooling technology based on electrocaloric materials shows promising potential for addressing electronic overheating challenges. Here, the authors employ two-dimensional polyamide to enhance the electrocaloric cooling performance by reducing intermolecular interactions and facilitating electrocaloric phase transitions thereby, offering insights into the application of spatially confined materials in flexible electronics.
科研通智能强力驱动
Strongly Powered by AbleSci AI