腐蚀
材料科学
电化学
纹理(宇宙学)
冶金
蚀刻(微加工)
电流密度
表面光洁度
堆积
粒度
电极
复合材料
化学
图层(电子)
计算机科学
有机化学
人工智能
物理化学
物理
图像(数学)
量子力学
作者
Jenn‐Ming Song,Yong-Sheng Zou,Chia-Chen Kuo,Shi-Ching Lin
标识
DOI:10.1016/j.corsci.2013.04.046
摘要
In this study, the electrochemical corrosion properties of electrodeposited Cu foils in a CuCl2-containing acidic etching solution were investigated. The main passive product was CuCl and a trace amount of Cu2O can also be detected. The (2 2 0)-oriented Cu foils exhibited higher corrosion potential and lower corrosion current density than those with (1 1 1) or (2 0 0) texture, suggesting a superior corrosion resistance against the etching solution. It is proposed that the preferred orientation and thus the differences in atomic stacking density on specific planes dominated the corrosion properties of the electrodeposited Cu foils instead of grain size or surface roughness.
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