半导体器件制造
半导体工业
计量学
过程(计算)
薄脆饼
制造工程
计算机科学
制造工艺
比例(比率)
可靠性工程
晶圆制造
制造业
系统工程
风险分析(工程)
工程类
业务
材料科学
电气工程
物理
复合材料
营销
操作系统
统计
量子力学
数学
标识
DOI:10.1364/aio.2011.aituc1
摘要
Central to the phenomenal success of the semiconductor industry to achieve the large scale integration predicted by Moore's law is the ability to innovate on every aspect of the manufacturing process. Economic considerations necessitate the achievement of very high yields, which is only possible through a methodical approach to detection, classification, and eventual elimination of the defects that plague the complex processes. Thus, wafer inspection tools play a vital role in the development of new processes to achieve a particular deign rule.
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