On the Use of the Hole-Drilling Technique for Residual Stress Measurements in Thin Plates

The strain gage blind hole-drilling technique may be used to determine residual stresses at and below the surface of components. In this paper, the hole-drilling analysis methodology for thick plates is reviewed, and experimental data are used to evaluate the methodology and to assess its applicability to thin plates. Data on the effects of gage pattern, surface preparation, hole spacing, hole eccentricity, and stress level are also presented.