材料科学
反铁电性
铁电性
相(物质)
转化(遗传学)
拉伤
微观结构
基质(水族馆)
薄膜
应变工程
复合材料
凝聚态物理
光电子学
纳米技术
电介质
物理
内科学
地质学
海洋学
有机化学
化学
基因
医学
硅
生物化学
作者
Meysam Sharifzadeh Mirshekarloo,Kui Yao,Thirumany Sritharan
标识
DOI:10.1002/adfm.201200832
摘要
Abstract Coupling effects among mechanical, electrical and magnetic parameters in thin film structures including ferroic thin films provide exciting opportunity for creating device functionalities. For thin films deposited on a substrate, their mechanical stress and microstructure are usually determined by the composition and processing of the films and the lattice and thermal mismatch with the substrate. Here it is found that the stress and structure of an antiferroelectric (Pb 0.97 ,La 0.02 )(Zr 0.90 ,Sn 0.05 ,Ti 0.05 )O 3 (PLZST) thin film are changed completely by a ferroelastic strain in a magnetic shape memory (MSM) alloy Ni‐Mn‐Ga (NMG) thin film on the top of the PLZST, despite the existence of the substrate constraint. The ferroelastic strain in the NMG film results in antiferroelectric (AFE) to ferroelectric (FE) phase transformation in the PLZST layer underneath. This finding indicates a different strategy to modulate the structure and function for multilayer thin films and to create unprecedented devices with ferroic thin films.
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