制造工程
半导体器件制造
材料科学
工程类
半导体
工程物理
光电子学
薄脆饼
作者
R.R. Doering,Yoshio Nishi
出处
期刊:CRC Press eBooks
[Informa]
日期:2010-02-24
被引量:479
标识
DOI:10.1201/9781420017663
摘要
Overview of semiconductor devices introduction to semiconductor equipment silicon materials surface preparation ion implantation dopant diffusion oxidation silicidation rapid thermal processing overview of interconnect chemical vapourdeposition alternate interlevel dielectrics polymide dielectrics physical vapour deposition chemical-mechanical polish optical lithography photoresist materials and processing x-ray lithography electron-beam lithography photomask fabrication plasma etching equipment reliability overview of process control in-line metrology in-situ metrology yield modelling yield management electrical, physical and chemical characterization failure analysis. Appendices: glossary of manufacturing terms acronyms used in semiconductor manufacturing standards and specifications units of measure and conversion tables useful constants.
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