金属有机气相外延
光电子学
薄脆饼
材料科学
外延
规格#
CMOS芯片
堆栈(抽象数据类型)
图层(电子)
纳米技术
计算机科学
程序设计语言
作者
Li Zhang,Kwang Hong Lee,Riko I Made,C. C. Huang,Abdul Kadir,Kenneth E. Lee,Soo Jin Chua,Eugene A. Fitzgerald
标识
DOI:10.1088/1361-6641/aa681c
摘要
We describe the results produced from our research on integrating GaN devices with Si CMOS integrated circuits. High quality, low bow and robust 200 mm GaN on SEMI-spec epitaxial Si (725 μm) wafers are achieved by using a unique shaped susceptor and careful control of buffer design. High brightness InGaN/GaN MQW LEDs emitting at 450 nm with total III-N stack thickness of 3.6 μm have also been demonstrated. The growth technology of GaN on SEMI-spec 200 mm leads to new wafer/device platforms such as GaN-OI and CMOS + GaN that will open new avenues in device performance and integration of III-N devices with Si CMOS.
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