纳米线
CMOS芯片
金属浇口
工作职能
材料科学
光电子学
晶体管
兴奋剂
硅纳米线
硅
纳米技术
MOSFET
电气工程
电压
栅氧化层
工程类
图层(电子)
作者
Hans Mertens,R. Ritzenthaler,Adrian Chasin,T. Schram,E. Kunnen,Andriy Hikavyy,Lars‐Åke Ragnarsson,Harold Dekkers,T. Hopf,Kurt Wostyn,K. Devriendt,Soon Aik Chew,M. S. Kim,Yoshiaki Kikuchi,Erik Rosseel,G. Mannaert,S. Kubicek,S. Demuynck,A. Dangol,N. Bosman
标识
DOI:10.1109/iedm.2016.7838456
摘要
We report on the CMOS integration of vertically stacked gate-all-around (GAA) silicon nanowire MOSFETs, with matched threshold voltages (V t, sat ~ 0.35 V) for N- and P-type devices. The Vt setting is enabled by nanowire-compatible dual-work-function metal integration in a high-k last replacement metal gate process. Furthermore, we demonstrate that N- and P-type junction formation can influence nanowire release differently due to both implantation-induced SiGe/Si intermixing and doping effects. These findings underline that junction formation and nanowire release require co-optimization in GAA CMOS technologies.
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