材料科学
电介质
复合材料
介电损耗
制作
纳米颗粒
介电强度
高-κ电介质
聚合物
光电子学
纳米技术
医学
病理
替代医学
作者
Zhihui Jiang,Wendong Li,Xiong Yang,Xi Chen,Chao Wang,Mingyu Chen,Guanjun Zhang
标识
DOI:10.1016/j.compositesb.2020.108013
摘要
High-k, UV curable polymer composites with low dielectric loss and high breakdown strength were prepared. Fluorosilane coupling agent (FAS-17) was adopted to modify the surface of BaTiO3 (BT) nanoparticles. Characterization results of UV-cured composites filled with [email protected] particles indicate that the dielectric loss is dramatically decreased and the breakdown strength is significantly improved, especially for the highly-loaded composites. The underlying mechanism of these performance improvements is further studied by temperature-dependent dielectric spectra, thermally stimulated depolarization current experiments as well as the first-principle simulation, which suggest that H-bonding and additional interfacial traps introduced by FAS-17 account for the enhanced dielectric properties. This work proposes a facile and efficient technique for the fabrication of photosensitive high-k composites with low dielectric loss and high breakdown strength, which is suitable for a variety of advanced applications such as energy storage, functionally graded dielectric materials and 3D-printing fabrication of dielectrics.
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