Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling

Abstract In the rapidly advancing semiconductor sector, thermal management of chips remains a pivotal concern. Inherent heat generation during their operation can lead to a range of issues such as potential thermal runaway, diminished lifespan, and current leakage. To mitigate these challenges, the study introduces a superhygroscopic hydrogel embedded with metal ions. Capitalizing on intrinsic coordination chemistry, the metallic ions in the hydrogel form robust coordination structures with non‐metallic nitrogen and oxygen through empty electron orbitals and lone electron pairs. This unique structure serves as an active site for water adsorption, beginning with a primary layer of chemisorbed water molecules and subsequently facilitating multi‐layer physisorption via Van der Waals forces. Remarkably, the cobalt‐integrated hydrogel demonstrates the capability to harvest over 1 and 5 g g −1 atmospheric water at 60% RH and 95% RH, respectively. Furthermore, the hydrogel efficiently releases the entirety of its absorbed water at a modest 40°C, enabling its recyclability. Owing to its significant water absorption capacity and minimal dehydration temperature, the hydrogel can reduce chip temperatures by 5°C during the dehydration process, offering a sustainable solution to thermal management in electronics.