聚酰亚胺
电介质
材料科学
缩聚物
高分子化学
单体
玻璃化转变
乙醚
热的
复合材料
分析化学(期刊)
化学工程
有机化学
化学
聚合物
热力学
光电子学
图层(电子)
工程类
物理
作者
Ya‐Fei Yu,Wenjie Zhu,Huiting Li,Jun Long,Wenheng Huang,Jinchao Li,Liang Chen,Yaping Zhang
标识
DOI:10.1016/j.eurpolymj.2023.112653
摘要
A set of colorless polyimide (CPI) films with norbornene-aliphatic ring structures has here been prepared through polycondensation reactions by using cyclopentanone bis-spironorbornane tetracarboxylic dianhydride (CpODA), 4,4′-(hexafluoroisopropyl)diphthalic anhydride (6FDA) and 4,4′-diaminodiphenyl ether (ODA) monomers as raw materials. The transmissivities, dielectric properties and thermal stabilities of CPI films are optimized by adjusting the CpODA-to-6FDA molar ratios. Compared with the aromatic and aliphatic PI films, the thermal stabilities and transmissivities of CPI films are well balanced. Moreover, the CPI films possessed low dielectric constants and low dielectric losses. The thermal expansion coefficients, temperatures at a 5% weight loss and glass-transition temperatures are maintained at 31–41 ppm K−1, 461–484 °C and 348–362 °C, respectively. In addition, the transmittances (86–89%), dielectric constants (2.15–2.47) and dielectric losses (<0.023) are all prominent. In short, the CPI films have been shown to have a high potential for use in the display technology.
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